System Integrated Design and Manufacture – Built-in Flexibility

We start by analyzing the performance issues determined by our clients. With years of expertise in defense electronics, our team is well-suited to developing solutions to our clients’ electronics integration challenges. State-of-the-art simulation/modeling and electronic design automation tools and processes are used to model the best solution – integrating dielectrics, conductors, semiconductors, and other materials as needed. SI2 works to integrate electronics directly with the platform structure wherever possible so as to reduce platform size, weight, power consumption, and cost relative to conventional electronics solutions. Specifically, our unique, cost-effective Direct Write and patent-pending Laser Transfer manufacturing methods are employed to fabricate the electronic system required. In summary, SI2 provides “smart” pathways to the design and manufacture of space- and size-constrained electronic systems.

System Integrated Design and Manufacturing (SIDM)

SI2’s SIDM methodology is a state-of-the-art approach to producing electronics integrated with structural members. In this approach, the circuitry is custom designed and manufactured specifically for the curved structures that will support it. The structural design and the electronic design are interactive through the use of advanced computer tools to model and simulate the system performance as materials and manufacturing methods are chosen. SI2’s SIDM methodology utilizes state-of-the-art manufacturing processes such as Direct Write and design tools along with materials that are compatible with the manufacturing processes and intended operating environment. Direct Write and Laser Transfer manufacturing are a key component of SI2’s SIDM process for conformal electronics.

Direct Write (Digital Printing) Manufacturing

Direct Write is a family of techniques for “writing” or printing electronic circuits on low-temperature and/or curved surfaces directly from a computer file (e.g. micropen dispensing of electrically-conductive ink) without any tooling, masks, etc. The key attributes of Direct Write are 1) relatively low processing temperatures (which enables the use of a large number of structural materials, including composites), and 2) the conformal nature of the deposition, which enables the integration of electronics with curved surfaces. Both active and passive electronics can be printed onto curved structural components for avionics integration.

SI2’s Direct Write processes do not require harsh etchants or special atmospheres; as such, costly and slow-to-operate vacuum equipment is not required. These technologies are capable of depositing a wide variety of materials onto a number of substrates. Using a computer-controlled positioning system, electrically-insulating, semiconducting, and conductive materials are printed only where they are needed.

Laser Transfer of Electronic Devices

SI2 is also developing Laser Transfer to “print” pre-fabricated chip-sized devices onto curved substrates. With this process, semiconductor chips (receivers, amplifiers, switches, etc.) can be printed onto curved structures. Together with Direct Write interconnects and devices (e.g. passive components), Laser Transfer enables the manufacture of truly smart structures.

As in our other Direct Write processes, no special atmospheres (vacuum, high pressure, specialty gases) or high temperatures are required to Laser Transfer the pre-fabricated electronics, and none of the traditional thin film transistor processing steps (e.g., laser recrystallization) are needed prior to component use. Laser Transfer is used to place and attach prefabricated, chip-based devices (e.g. sensors) onto curved substrates to fabricate a conformal electronic system with significant electronic functionality. The process accommodates standard, commercially available semiconductor devices manufactured using established techniques. All fabrication of the actual on-chip microelectronics (lithography, implantation, metallization, etc.) takes place upstream of SI2’s transfer process.